SLE Secure Memory Smart Cards
Identity Management Simplified
The state-of-the-art uTrust MD security model leverages smart card technology, PKI, and digital certificates, and features secure data storage, user-based access to data, and worldwide-approved EAL 5+ Common Criteria accreditation.
- RSA-based data signature and/or encryption (up to 2048-bit)
- Set/change/unblock PIN via Windows User Interface (UI)
- Digital certificate enrollment and import
Secure Windows-Compatible Access
Based on X.509 digital certificates, these strong-authentication credentials are ideal for computer security applications. The Microsoft Smart Card Base CSP is a cryptographic service provider integrated into Windows, enabling Minidriver-compatible smart cards to support Microsoft-compatible security applications, including Windows Domain Log-On, VPN, Outlook® email signing and encryption, secure web access, and Wireless LAN authentication. Compatibility also ensures support for a variety of smart card management systems (CMS) and Certificate Authorities (CA).
uTrust V1.0 80K MD Dual Smart Card with MIFARE Classic 1K and 125 KHz Proximity
uTrust MD Smart Card
Certificate-Based Public Key Infrastructure (PKI) Credential for
Microsoft® Minidriver (MD)
Plug and Play
Ready-to-use off the shelf and fully compatible with Microsoft Windows
Smart Card Framework (WSF)
Supports existing Microsoft-compatible logical access security applications,
including Windows Domain Log-On, VPN, Outlook® email signing and
encryption, secure web access, Wireless LAN authentication, and VPN
Combines digital certificate-based PKI smart cards with physical access
credentials, including 13.56 MHz and 125 KHz proximity
The Infineon Smart Card Modules and innovative Coil on Module (CoM) packaging technology from Infineon uses a radio frequency link instead of the mechanical/electrical
connection typically used between the card antenna and the module. This improves the robustness and long-term reliability of dualinterface (DIF) payment cards as well as ID documents and simplifies card design, manufacturing and logistics, making these processes
more efficient and up to five times faster than with conventional technologies.
Based on our extensive semiconductor and module expertise as well as our profound understanding of card manufacturers’ systems and
requirements, COM underlines our technology leadership in this field.
CoM design featuring inductive coupling
Inductive coupling technology for DIF applications employs two antennas, one on the module and one on the card inlay. These antennas
connect electromagnetically, functioning in a similar way to the air interface of contactless cards.